Leadership 2020
Leadership 2020
Data/Tele IcT
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Data Center/Telecom
Michael Robertson (Huawei)
Michael Lebby (Lightwave Logic)
Sensors
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IoT & Industrial equipment
Christophe Py (CNRC)
Rich Grzybowski, Macom
Automotive
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Aerospace
David Mackey (MBryonics)
Katarzyna Balakier (Airbus)
Rolf Evenbleij (Technobis)
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Healthcare
Thierry Robin (Thematys)
Anu Agarwal, Massachusetts Institute of Technology (MIT)
Photonic Modules
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RF Photonics
Guillermo Carpintero (University of Valencia)
Arthur Paolella (Harris)
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Integrated Photonic Sensors
Ben Miller, University of Rochester
Anu Agarwal, Massachusetts Institute of Technology (MIT)
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IPSR Cost Emulators
Randolph Kirchain, Massachusetts Institute of Technology (MIT)
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Electronic Photonic Design Automation
Twan Korthorst (Synopsis / Phoenix)
Tom Daspit (Mentor)
Front-end
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Monolithic Silicon Integration
Abdul Rahim / Roel Baets (ePixfab/UGhent)
Lionel Kimerling, Massachusetts Institute of Technology (MIT)
Ajey Jacob
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InP & III-V compounds
Mike Wale (TU/e)
Gloria Hoefler (Infinera)
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SiN
Sami Musa (Vision & actions)
Lionel Kimerling (MIT)
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Polymers
Felix Betschon (Vario optics)
Michael Lebby (Lightwave Logic)
Back-end
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Packaging
Peter 'O Brien (Tyndall)
Bill Bottoms (3MTS)
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Interconnects
Peter Maat (Astron)
Terry Smith (3m) (r.)
John MacWilliams
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Assembly
Paul van Dijk (LioniX-International)
Yi Quan (MRSI Systems)
Dick Otte (Promex Industries)
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Testing